Method for mounting a wafer loading device to a process machine

Metal working – Barrier layer or semiconductor device making

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Details

414935, 211 411, H01L 2168

Patent

active

058688030

ABSTRACT:
The present invention discloses a method for mounting a peripheral device, such as a wafer loading device, to a semiconductor process tool that includes sensor means in the mounting surface of the peripheral device such that improper mounting between the two components can be detected and a signal can be sent out to a host computer to disable the peripheral device and to stop its motion and thus prevent any damages to the components or the substrates it carries. The peripheral device may further include spring means mounted in its mounting surface to enable the peripheral device to be pushed away from the process tool to provide a visual indication to a machine operator when the two components are not properly mounted together.

REFERENCES:
patent: 4764076 (1988-08-01), Layman et al.
patent: 4974166 (1990-11-01), Maney et al.
patent: 5166884 (1992-11-01), Maney et al.

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