Semiconductor device

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324110, 324549, 324765, 361220, G01R 2700

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active

056708858

ABSTRACT:
A semiconductor device has a first-conduction-type semiconductor substrate (19), an internal circuit including a vertical bipolar transistor (18) formed in a second-conduction-type semiconductor layer (20), and a protective element (14). The protective element comprises a first-conduction-type diffusion layer (22a) formed at an upper part of a second-conduction-type semiconductor layer (20a) disposed on the semiconductor substrate (19), and a second-conduction-type diffusion layer (27, 30) formed in the first-conduction-type diffusion layer (22a). The diffusion layer (27, 30) is at least partly deeper than an emitter diffusion layer (23) of the vertical bipolar transistor (18).

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Patent Abstracts of Japan, vol. 11, No. 187 (E-516) 16 Jun. 1987 & JP-A-62-018063 (NEC Corp) 27 Jan. 1987.
Chapron, "Les circuits integres bipolaires: comment diminuer leur sensibilite aux decharges electrostatiques," Revue Generale de l'Electricite, vol. 2, Feb. 1987, Paris, FR, pp. 19-24.
Tailliet et al., "Characterization of an n-p-n Structure under ESD Stress and Proposed Electrical Model," IEEE Transactions on Electron Devices, vol. 37, No. 4, Apr. 1990, New York, NY, pp. 1111-1120.

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