Lead-frame forming material

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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4302751, 4302771, 427289, 427327, G03F 709, G03F 7095

Patent

active

056702930

ABSTRACT:
Disclosed are a positive type lead-frame forming material which contains a light-sensitive material comprising an o-quinonediazide compound and a novolak resin, and a positive type lead-frame forming material which contains a positive resist composition comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing a group decomposable by acid which can increase its solubility in an alkaline developer through the action of the acid.

REFERENCES:
patent: 4342151 (1982-08-01), Guild
patent: 5098814 (1992-03-01), Tunney et al.
Guild, "Blank and Process for the Formation of Beam Leads for IC Chip Bonding", Research Disclosure, Disclosure No. 18570, 185(1):523-526 (Sep., 1979).
An, "A Light-Sensitive Material Having a Matting Layer", Research Disclosure, Disclosure No. 18055, 180(0):161 (Apr., 1979).

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