Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-08-02
1987-02-17
Czaja, Donald
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29458, 156305, 156325, C09J 100
Patent
active
046437924
ABSTRACT:
A chemically implemented method is disclosed for producing structural connections between pairs of members, a portion of the first member being telescoped within an opening formed by and within the second member, such connections being substantially comparable in strength and rigidity to connections produced by forced fit or by thermal shrinkage methods.
Members are formed to provide for mutual fits which may range from "course clearance fit" to "light push fit", allowing generally for hand assembly. Prior to assembly the interfacing surfaces are coated with simple ferrous oxide. After assembly the members are clamped or supported temporarily to provide immobility to the joint during the expansive conversion of simple ferrous oxide to higher levels of ferric oxide via the introduction of strong hydrogen peroxide into the interstices of the joint. The clamp or support is then removed leaving a strong and compressively impacted joint.
In the eventuality that the joint is to be disassembled for maintenance, repair, or transportation, a penetrating solvent solution providing a reduction reaction is used to dissolve and weaken the impacting oxides.
REFERENCES:
patent: 2638429 (1953-05-01), Patterson
The Merck Index; Martha Windholz, Editor; 9th Ed.; 1976; p. 4695.
Czaja Donald
Davis J.
LandOfFree
Method for chemically structuralizing telescopic joints does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for chemically structuralizing telescopic joints, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for chemically structuralizing telescopic joints will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1937981