Soldering method

Details Soldering method Soldering method

1996-03-22

1997-09-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228205, 22818022, H05K 334, B23K 35363

Patent

active

056695489

ABSTRACT:
A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C.sub.14 H.sub.30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained.

REFERENCES:
patent: 4165244 (1979-08-01), Jacobs
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5558271 (1996-09-01), Rostoker et al.

Affiliated with

Also associated with

Rating

Soldering method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1936826