High efficiency thermal interposer

Details High efficiency thermal interposer High efficiency thermal interposer

1993-12-22

1997-09-23

Ford, John K.

Heat exchange

Structural installation

165 803, 165186, 219209, 219229, 901 49, 228 59, 22818022, F28F 700, B23K 112

Patent

active

056694377

ABSTRACT:
A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.

REFERENCES:
patent: 2474615 (1949-06-01), Busquet
patent: 2891308 (1959-06-01), Lyonds
patent: 3161478 (1964-12-01), Chessin
patent: 3186811 (1965-06-01), Waivers
patent: 3267997 (1966-08-01), Matarese et al.
patent: 3327776 (1967-06-01), Butt
patent: 3437965 (1969-04-01), Ragsdale
patent: 3732919 (1973-05-01), Wilson
patent: 3941297 (1976-03-01), Burns et al.
patent: 3943323 (1976-03-01), Smith et al.
patent: 3946720 (1976-03-01), Keyes et al.
patent: 4036188 (1977-07-01), Sami et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4300715 (1981-11-01), Keizer et al.
patent: 4431474 (1984-02-01), Gronek et al.
patent: 4531146 (1985-07-01), Cutchaw
patent: 4593754 (1986-06-01), Holl
patent: 4600052 (1986-07-01), Wood, III et al.
patent: 4612978 (1986-09-01), Cutchaw
patent: 4730665 (1988-03-01), Cutchaw
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5042708 (1991-08-01), Ledermann et al.
patent: 5065932 (1991-11-01), Hayden et al.
Abstract of JA 61-293656, published May 23, 1987.

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