Semiconductor device including a plurality of leads each having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257670, 257671, 257686, 257723, 257787, H01L 2302

Patent

active

055593658

ABSTRACT:
Disclosed herein is a semiconductor device having a terminal bend protecting frame formed in the terminal tip parts by filling the spaces between the lead terminals with a resin of the same quality as that of the sealing resin. In other words, each of lead terminals led from a package has a first end portion extending upward and a second end portion extending downward.

REFERENCES:
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5394010 (1995-02-01), Tazawa

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