Method for manufacturing a circuit board

Details Method for manufacturing a circuit board Method for manufacturing a circuit board

1985-05-30

1987-12-01

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562737, 1562753, 219121LF, 219121LY, B32B 3128

Patent

active

047102535

ABSTRACT:
A circuit board is manufactured by applying a film of heat actuable adhesive to a substrate and depositing on the film a layer of a conductive powder. The powder and film are then activated by laser radiation or by direct contact with a heated plate. The excess powder is then removed and the substrate fired to cure or bond the powder to the substrate while removing excess adhesive film.

REFERENCES:
patent: 3214315 (1965-10-01), Hildebrand
patent: 3396401 (1968-08-01), Nonomura
patent: 3945318 (1976-03-01), Landsman
patent: 4081653 (1978-03-01), Koo
patent: 4159414 (1979-06-01), Suh
patent: 4496607 (1985-01-01), Mathias

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