High-density circuit and method of its manufacture

Recorders – Electric recording – Electrochemical

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

346150, G01D 1500

Patent

active

048976768

ABSTRACT:
The present invention is a high-density circuit, wherein the circuit conductors, and the spaces between conductors, are preferably less than about 0.005 inches wide, and wherein the lines are disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The invention includes the circuit itself, as well as processes used in its manufacture. The invention also includes a high-density print head, for a thermal or electrostatic printer, made from the circuit described. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image. The invention also includes a multi-layered version of the circuit, and a method of making the circuit with multiple layers. The invention permits the production of black and white or color halftone images having very large numbers of grey scale levels, and exceptional resolution.

REFERENCES:
patent: 2932710 (1960-04-01), Coale
patent: 3903594 (1975-09-01), Koneval
patent: 4076575 (1978-02-01), Chang
patent: 4289364 (1981-09-01), Strom
patent: 4289802 (1981-09-01), Micheli
patent: 4298786 (1981-11-01), Marciniec
patent: 4304624 (1981-12-01), Carson
patent: 4312897 (1982-01-01), Reimann
patent: 4339305 (1982-07-01), Jones
patent: 4344817 (1982-08-01), Chamberlin
patent: 4386116 (1983-05-01), Nair
patent: 4391849 (1983-07-01), Bischoff
patent: 4415403 (1983-11-01), Bakewell
patent: 4439270 (1984-03-01), Powell
patent: 4454014 (1984-06-01), Bischoff
patent: 4454167 (1984-06-01), Bernot
patent: 4502917 (1985-03-01), Chamberlin
patent: 4508753 (1985-04-01), Stepan
patent: 4508754 (1985-04-01), Stepan
patent: 4552615 (1985-11-01), Amendola
patent: 4566940 (1986-01-01), Itsumi
patent: 4569902 (1986-02-01), Saito
patent: 4574094 (1986-03-01), DeLuca
patent: 4581098 (1986-04-01), Gregor
patent: 4601777 (1986-07-01), Hawkins
patent: 4604298 (1986-08-01), Shevtchuk
patent: 4606787 (1986-08-01), Pelligrino
patent: 4606788 (1986-08-01), Moran
patent: 4609427 (1986-09-01), Inamoto
patent: 4612083 (1986-09-01), Yasumoto
patent: 4614563 (1986-09-01), Kubo
patent: 4617193 (1986-10-01), Wu
patent: 4622058 (1986-11-01), Leary-Renick
patent: 4623556 (1986-11-01), Brown
patent: 4657778 (1987-04-01), Moran
patent: 4670091 (1987-06-01), Thomas
patent: 4672737 (1987-06-01), Carson
patent: 4681656 (1987-07-01), Byrum
patent: 4685998 (1987-08-01), Quinn
patent: 4690833 (1987-09-01), Donson
patent: 4692205 (1987-09-01), Sachdev
patent: 4698125 (1987-10-01), Rhodes
Bulletin 1100, Max Levy Autograph, Inc.
Bulletin 1800, Max Leavy Autograph, Inc.
Catalog of Electro-Science Laboratories, Inc.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-density circuit and method of its manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density circuit and method of its manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density circuit and method of its manufacture will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1926231

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.