Method of bonding two substrate faces utilizing boron-silicon-hy

Details Method of bonding two substrate faces utilizing boron-silicon-hy Method of bonding two substrate faces utilizing boron-silicon-hy

1985-06-24

1987-08-25

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156150, 156151, 4272481, 427255, 4272551, 4272552, B32B 3106

Patent

active

046891048

ABSTRACT:
Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates. The mtal substrates are further protected against deterioration by the effects of the recombination of dissociated oxygen and nitrogen by converting the solid boron-silicon-hydrogen alloy film to solid boron-silicon oxide film.

REFERENCES:
patent: 3197858 (1965-08-01), Feduska et al.
patent: 3455745 (1969-07-01), Kern et al.

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