Article comprising a stacked array of electronic subassemblies

Details Article comprising a stacked array of electronic subassemblies Article comprising a stacked array of electronic subassemblies

1990-05-10

1991-09-17

LaRoche, Eugene R.

357 75, H01L 2302

Patent

active

050499823

ABSTRACT:
Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits and a thermally conductive base member that is perforated with holes. Motivating means are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.

REFERENCES:
patent: 3727114 (1973-04-01), Oshima
IBM Technical Disclosure Bulletin, vol. 28 No. 2, Jul. 1985, "Bipolar-Fet Package Design".

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