Method for forming gold ribbon connectors for microwave integrat

Details Method for forming gold ribbon connectors for microwave integrat Method for forming gold ribbon connectors for microwave integrat

1991-04-12

1992-10-20

Quach, T. N.

Fishing, trapping, and vermin destroying

437180, 437246, H01L 21283, H01L 2144

Patent

active

051569965

ABSTRACT:
To fabricate a ribbon connector for microwave integrated circuit use, an as fired, unclad alumina substrate is coated with a thin film of gold applied by sputter metallization. The thin layer of gold is then built up to a required ribbon thickness by an electroplating process. The thicker layer of gold is then etched by means of standard gold etching techniques where dimensions of the formed ribbons are determined by the precision process of photo reduction and masking rather than cutting and shaping of parts. This process also provides a convenient way to store and transfer these specially shaped ribbons and is amenable to use in mass production environments.

REFERENCES:
patent: 3747202 (1973-07-01), Jordan
patent: 3795043 (1974-03-01), Forlani
patent: 3952404 (1976-04-01), Matunami
patent: 3997963 (1976-12-01), Riseman
patent: 4011144 (1977-03-01), Bachman
patent: 4022641 (1977-05-01), Lindberg
patent: 4577213 (1986-03-01), Bauhahn

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