Radiation curable solvent-free compositions recovery system

Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy

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Details

20415918, 525194, 525213, 525231, 525257, 525298, C08F 250, C08J 328, C08K 503, C08L 2908

Patent

active

043349706

ABSTRACT:
An improved photosensitive resin system being essentially solvent-free which contains an ester produced from an unsaturated organic acid and a polyhydroxyl containing material, a photoinitiator, a carbonyl initiator, and a monomer capable of reacting with an acrylic monomer, wherein an improvement comprises an additional component comprising an unsaturated hydroxyl containing polymer hydrocarbon. The improved composition has curing rates far in excess of those systems not using the hydroxyl containing unsaturated polymer. In particular, the advantages obtained through the use of the additional component are much faster curing of the composition, exceptional gloss, toughness, abrasion resistance and good rub resistance.

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