Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1984-02-23
1986-04-22
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228 10, 228 11, 228 47, B23K 3102, B23K 300
Patent
active
045836744
ABSTRACT:
Printed circuit boards 10 having connector terminals 14 and 16 overlaying contact pads 17 and 18 are loaded into fixtures 22 which are conveyor 31 advanced through a pair of solder applying stations 33 and 34 whereat solder is laid and melted at the junctures of the terminals and contact pads. As a fixture approaches a solder applying station, the conveyor is slowed down and a programmed controller 170 is enabled for operation. If a circuit board is sensed by a photodetector 172, a second photodetector is rendered effective to sense elements 176 projecting from a side of the fixture. The sensed elements 176 effectuate the generation of count pulses and output signals to control the movements of solder applying devices 36 to soldering sites where solder feed devices 136 lay discontinuous stripes of solder at the junctures of the contact pads and terminals.
REFERENCES:
patent: 3140684 (1964-07-01), Aronson
patent: 3393853 (1968-07-01), Durr et al.
patent: 4204477 (1980-05-01), Holstein
patent: 4230257 (1980-10-01), Genson
patent: 4468741 (1984-08-01), Simonton
"The Assembly of Surface Mounted Connectors to Bellpac Boards", The Engineer, Third issue, 1983, pp. 30-35.
Dines David R.
Svoboda George
Workman Robert G.
AT&T - Technologies, Inc.
de Picciotto M.
Godici Nicholas P.
Heinrich Samuel M.
Miller R. P.
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