Fixed abrasive polishing system for the manufacture of semicondu

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

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438592, 438593, H01L 21302

Patent

active

060690801

ABSTRACT:
A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.

REFERENCES:
patent: 2609347 (1952-09-01), Wilson
patent: 2664366 (1953-12-01), Wilson
patent: 2806772 (1957-09-01), Robie
patent: 4343910 (1982-08-01), Busch, Jr. et al.
patent: 4466218 (1984-08-01), Ottman et al.
patent: 4799939 (1989-01-01), Bloecher et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5197999 (1993-03-01), Thomas
patent: 5209760 (1993-05-01), Wiand
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5435816 (1995-07-01), Spurgeon et al.
patent: 5441598 (1995-08-01), Yu et al.
patent: 5454844 (1995-10-01), Hibbard et al.
patent: 5647879 (1997-07-01), Kubo
patent: 5664990 (1997-09-01), Adams et al.
patent: 5868605 (1999-02-01), Cesna

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