Method of injection molding elements such as semiconductor eleme

Details Method of injection molding elements such as semiconductor eleme Method of injection molding elements such as semiconductor eleme

1997-07-25

2000-05-30

Heitbrink, Jill L.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

2643284, 2643288, 425544, 425561, B29C 4502, B29C 4518, B29C 4553

Patent

active

060688092

ABSTRACT:
In a method of injection molding elements, a first step is to charge a molding compound into an injection nozzle via a side hole defined in the nozzle under the control of a mini-plunger which is selectively reciprocally movable within a bore of the injection nozzle. In a second step, the mini-plunger is reciprocally moved in the bore of the nozzle for injecting substantially the entire molding compound in the bore of the injection nozzle into at least one cavity of a mold via a separate gate passage defined in the mold. Each gate passage is a narrow capillary aperture that connects the bore of the injection nozzle with a different one of the at least one cavity of the mold. In a third step, the nozzle and the mold are separated after the molding compound in the gate passage is cured but before the molding compound in the at least one cavity of the mold is cured. In a fourth step the molded element is removed from the at least one cavity of the mold once the molding compound therein is cured.

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