Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-07-31
1982-11-30
Ozaki, G.
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29577C, 29578, 148 15, 148187, H01L 2126
Patent
active
043609635
ABSTRACT:
In a method of making a CCD imager on a semiconductor wafer, it is usual to have the imagers spaced from the outer periphery of the wafer. The method includes a sequence of steps including masking the appropriate surface of the wafer, defining openings in the mask and forming doped regions in the wafer through the opening. In accordance with this invention, the region of the semiconductor wafer adjacent the outer periphery is not doped during any doping steps. It has been found that with this method, dislocations do not nucleate and propagate into the area of the wafer where the CCD imagers are to be formed and that white spots and lines in the visual image formed from the imager are significantly reduced.
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Burke William J.
Cohen Donald S.
Morris Birgit E.
Ozaki G.
RCA Corporation
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