Polishing device and polishing cloth for semiconductor substrate

Abrading – Precision device or process - or with condition responsive... – By optical sensor

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451537, B24D 722

Patent

active

060685409

ABSTRACT:
The polishing device grinds or polishes semiconductor substrates. The device includes a polishing table, into which a measuring device is integrated and a through opening. A polishing cloth covers the polishing table. The polishing cloth has at least one opening formed therein which corresponds to the through opening in the polishing table. The invention also relates to a polishing cloth for use in the polishing device.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5609719 (1997-03-01), Hempel
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5893796 (1999-04-01), Birang et al.

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