Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1999-01-11
2000-02-15
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438722, 438734, H01L 2100, H01L 21336
Patent
active
06025274&
ABSTRACT:
A method fabricating salicide. A substrate having a polysilicon gate and a source/drain region is provided. A silicon oxide layer is formed on the polysilicon gate and the substrate. Using dry etch, a part of the silicon oxide layer is removed to leave a spacer with a waistline on a side wall of the polysilicon gate. A metal layer is formed on the polysilicon gate and the source/drain region. A rapid thermal process is performed to form a metal silicide
REFERENCES:
patent: 5612239 (1997-03-01), Lin et al.
patent: 5776835 (1998-07-01), Yeh et al.
patent: 5915204 (1999-06-01), Sumi
patent: 5953612 (1999-09-01), Lin et al.
Chou Jih-Wen
Lin Tony
Brown Charlotte A.
Huang Jiawei
United Microelectronics Corp.
Utech Benjamin L.
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