Self-aligning liquid-cooling assembly

Details Self-aligning liquid-cooling assembly Self-aligning liquid-cooling assembly

1987-10-13

1988-12-20

Yeung, James C.

Heat exchange

With retainer for removable article

Electrical component

165 46, 361385, F28F 700

Patent

active

047919833

ABSTRACT:
An assembly for cooling an array of IC packages which have respective non-coplanar heat dissipating surfaces, comprises: a frame that is attachable to the array and has multiple beams, each of which is positioned to overlie some of the IC packages; respective liquid-cooling jackets for the IC packages with each jacket having a heat absorbing face; each jacket being mounted via a post that is loosely fitted through a respective hole in one of the beams in proximity with a respective one of the IC packages; and each jacket mounting providing a flexible connection which allows the jacket's heat absorbing face to be placed at multiple angles and different heights, and thereby coincide with the non-coplanar heat dissipating surface of an IC package.

REFERENCES:
patent: 4093971 (1978-06-01), Chu et al.
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4193445 (1980-03-01), Chu et al.
patent: 4448240 (1984-05-01), Sharon
patent: 4671204 (1987-06-01), Ballou
Module Board Service Frame, Cannistra et al., IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1979.

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