Smart card with card body and semiconductor chip on a leadframe

Details Smart card with card body and semiconductor chip on a leadframe Smart card with card body and semiconductor chip on a leadframe

1999-02-01

2000-05-30

Frech, Karl D.

Registers

Records

235492, G06K 1900

Patent

active

060681918

ABSTRACT:
The smart card has a semiconductor chip combined with a leadframe. The smart card is rendered operationally and functionally reliable with regard to bending and tensile stresses, in that the connecting tabs which form the electrical contacts of the leadframe are extended to the outside and embedded in the plastic card body. Beads are incorporated for the additional relief of mechanical stresses.

REFERENCES:
patent: 5834755 (1998-11-01), Haghiri-Tehrani et al.
Patent Abstracts of Japan No. 03-187792 (Koichiro), dated Aug. 15, 1991.
Patent Abstracts of Japan No. 02-261696 (Tetsushisa), dated Oct. 24, 1990.

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