Method for preparing resist patterns through image layer transfe

Details Method for preparing resist patterns through image layer transfe Method for preparing resist patterns through image layer transfe

1993-05-04

1994-04-19

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Transfer procedure between image and image layer, image...

Image layer portion transfer and element therefor

430258, 430315, 430325, 430326, 430328, 430329, G03F 730, G03F 736, G03F 740

Patent

active

053044533

ABSTRACT:
A method of preparing a fine pattern on a substrate characterized by the dry development of a photoimaged, etch resistant pattern on a receiver substrate. The pattern is transferred from a carrier substrate to the receiver substrate via a hardenable liquid adhesive. This method eliminates adverse reflection effects caused from substrate topography in single layer photoresist systems and also avoids time consuming multiple coatings in multilayer photoresist systems used to make fine patterns. The method is particularly useful in the fabrication of integrated circuits and fine dimension patterns.

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