Method of reducing agglomerate particles in a polishing slurry

Details Method of reducing agglomerate particles in a polishing slurry Method of reducing agglomerate particles in a polishing slurry

1998-05-21

2000-02-15

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 88, 216 89, 451289, B24D 1700, H01L 2100

Patent

active

060248297

ABSTRACT:
The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method includes transferring a slurry that has a design particle size from a slurry source to an energy source. In many instances, the slurry forms an agglomerate that has an agglomerated particle size, which is substantially larger than the design particle size. This larger particle size is highly undesirable because it can damage the semiconductor wafer surface as it is polished. The method further includes subjecting the agglomerate to energy, such as an ultra sonic wave emanating from the energy source, and transferring energy from the energy source to the slurry to reduce the agglomerated particle size to substantially the design particle size.

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patent: 5738573 (1998-04-01), Yueh
Halliday, David and Resnick, Robert. Fundamentals of Physics, John Wiley & Sons, Inc. p. 323, Jan. 1, 1970.

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