Metal pin grid array package

Details Metal pin grid array package Metal pin grid array package

1989-11-29

1992-04-07

James, Andrew J.

357 72, H01L 2350, H01L 2334

Patent

active

051032929

ABSTRACT:
A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

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Toshiba CMOS ASIC's New Product Release: Metal Pin-Grid Array Package; Mar. 1988; Version 1.

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