Fishing – trapping – and vermin destroying
Patent
1994-02-14
1996-05-14
Thomas, Tom
Fishing, trapping, and vermin destroying
437927, 148DIG73, H01L 2131
Patent
active
055167209
ABSTRACT:
A new method of trench isolation incorporating thermal stress releasing voids is described. Two sets of narrow trenches are etched into the silicon substrate not covered by a photoresist mask wherein the second set of trenches alternate with the first set of trenches. The first set of trenches is filled with an insulating layer. A second insulating layer is deposited over the surface of the substrate and within the second set of trenches wherein said insulating layer has step coverage such that voids are formed and are completely enclosed within the second set of trenches completing the thermal stress releasing device isolation of the integrated circuit. The method of forming thermal stress released polysilicon gate spacers in an integrated circuit is described. Polysilicon gate electrodes are formed on the surface of the semiconductor substrate. Successive sidewalls are formed on the gate electrodes of thin silicon dioxide, silicon nitride, and silicon dioxide. The silicon nitride spacers are removed leaving trenches between the thin silicon dioxide sidewalls and the silicon dioxide spacers. A thin insulating material is deposited over the surface of the gate electrodes and the sidewalls with a step coverage such that the trenches between the thin oxidation and the silicon dioxide spacers are not filled by the thin insulating layer but are covered by the thin insulating layer leaving voids which complete the thermal stress released polysilicon gate spacer formation in the fabrication of an integrated circuit.
REFERENCES:
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4639288 (1987-01-01), Price et al.
patent: 5041898 (1991-08-01), Urabe et al.
patent: 5099304 (1992-03-01), Takemura et al.
patent: 5119164 (1992-06-01), Sliwa, Jr. et al.
patent: 5278103 (1994-01-01), Mallon et al.
patent: 5292689 (1994-03-01), Cronin et al.
patent: 5308786 (1994-05-01), Lur et al.
S. Wolf & R. N. Tauber, "Silicon Processing for the VLSI Era" vol. I, 1986, pp. 335, 368-373.
S. Wolf, "Silicon Processing for the VLSI Era" vol. II, 1992, pp. 45-47, 54-56, 196-199, 240-241.
IBM Technical Disclosure Bulletin, vol. 28, #10, Mar. 1986 p. 4594, "Voidless Final Closure Process for Poly Trench".
VLSI Technology, International Edition by S. M. Sez, McGraw-Hill Book Co., N.Y. N.Y. c. 1988 by McGraw-Hill Book Co. pp. 473-474, 476-477.
Translation of JP 3-229443 (Saito).
Houn Edward
Lur Water
Pike Rosemary L. S.
Radomsky Leon
Saile George O.
Thomas Tom
United Microelectronics Corporation
LandOfFree
Stress relaxation in dielectric before metallization does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stress relaxation in dielectric before metallization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stress relaxation in dielectric before metallization will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1895479