Method of manufacturing multi-chip package

Details Method of manufacturing multi-chip package Method of manufacturing multi-chip package

1990-08-24

1992-04-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437206, 437 51, 437205, H01L 2184, H01L 2158, H01L 2160

Patent

active

051028310

ABSTRACT:
A method of manufacturing a multi-chip package having at least two IC chips mounted on a substrate is disclosed. In this method, metal layers each having an area larger than that of each of the IC chips are formed on substrate portions on which the IC chips are mounted. The IC's are bonded to surfaces of the metal layers. A wiring pattern is bonded to a region on the substrate where the IC chips are not mounted. The IC chips are wire-bonded to the wiring pattern.

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