Copper matrix electrode having carbon fibers therein

Details Copper matrix electrode having carbon fibers therein Copper matrix electrode having carbon fibers therein

1981-11-18

1984-09-04

James, Andrew J.

357 65, 357 68, 357 72, 357 81, H01L 2348, H01L 2940, H01L 2302, H01L 2946

Patent

active

044700636

ABSTRACT:
A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like shape or a loop shape substantially in parallel with a surface of the semiconductor substrate onto which the electrode is brazed. The carbon fibers disposed in an outer peripheral portion have a higher longitudinal elastic modulus than that of the carbon fibers positioned at a central portion of the electrode. The electrode thus has a thermal expansion coefficient approximating to that of the semiconductor substrate. Content of copper can be increased at the central portion of the electrode for attaining a high thermal conductivity.

REFERENCES:
patent: 4196442 (1980-04-01), Kuniya et al.

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