Method for manufacturing a semiconductor card with electrical co

Details Method for manufacturing a semiconductor card with electrical co Method for manufacturing a semiconductor card with electrical co

1989-04-20

1992-04-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 437220, 437216, 361398, 29835, 26427217, H01L 2348

Patent

active

051028280

ABSTRACT:
Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic place which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of adhesive material at high insulation. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions of said electric contacts emerge.
The place and at least one of the two series of contacts make part of a single starting metallic frame, on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame and to be superimposed by refolding or can be prepared separately and then applied on the first series.

REFERENCES:
patent: 3628105 (1971-12-01), Sakai et al.
patent: 4066851 (1978-01-01), White et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4307438 (1981-12-01), Grubb
patent: 4849617 (1989-07-01), Ueda

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