Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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437 63, 437141, 437193, 437247, 257518, H01L 2702

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active

051756072

ABSTRACT:
A p-type polycrystalline silicon layer (45) serving as the base electrode of an npn transistor and a p-type polycrystalline silicon layer (50) serving as the emitter electrode of a pnp transistor are simultaneously formed by forming a p-type polycrystalline silicon on the entire surface and patterning the same. Similarly, an n-type polycrystalline silicon layer (46) serving as the emitter electrode of the npn transistor and an n-type polycrystalline silicon layer (49) serving as the base electrode of the pnp transistor are simultaneously formed by forming an n-type polycrystalline silicon on the entire surface and patterning the same. Thus, electrodes can be formed without selective impurity implantation and the mask alignment therefor.

REFERENCES:
K. Toh et al., "A 23ps/2.1mW ECL Gate", ISSCC 89 Digest of Technical Papers, 1989, pp. 224-225.
C. Sung et al., "A 76 MHz Programmable Logic Sequencer", ISSCC 89 Digest of Technical Papers, 1989, pp. 118`119.

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