Process for making hybrid microcircuits providing accurate thick

Details Process for making hybrid microcircuits providing accurate thick Process for making hybrid microcircuits providing accurate thick

1989-05-01

1990-07-03

Echols, P. W.

Coating processes

Electrical product produced

Resistor for current control

29620, 338308, 338309, H01C 1706

Patent

active

049389971

ABSTRACT:
An improved process for fabricating thick film hybrid microcircuits that produces thick film resistors having electrical characteristics consistent with the microcircuit design tolerances, in areas proximate a dielectric build-up. The process includes, establishing by printing and firing a plurality of first conductor traces including the cross-under conductors to a substrate. Next, the resistive elements are printed and fired on the substrate and a dielectric glaze printed and fired over the resistive elements. At least one dielectric layer is then printed and fired over the cross-under conductors. A plurality of second conductor traces are next printed and fired on the substrate, including the cross-over conductors which are printed over the dielectric layer. Finally, a dielectric glaze is printed and fired over the cross-over conductors.

REFERENCES:
patent: 3669733 (1972-06-01), Allington
patent: 3787965 (1974-01-01), Cocca et al.
patent: 4796356 (1989-01-01), Ozaki

Affiliated with

Also associated with

Rating

Process for making hybrid microcircuits providing accurate thick does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for making hybrid microcircuits providing accurate thick, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making hybrid microcircuits providing accurate thick will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1889793