Method for fabricating connection device with reduced area of hi

Details Method for fabricating connection device with reduced area of hi Method for fabricating connection device with reduced area of hi

1993-12-27

1995-10-24

Fourson, George

Fishing, trapping, and vermin destroying

437978, 437228, H01L 2128, H01L 2144

Patent

active

054610044

ABSTRACT:
A semiconductor connection device capable of reducing the area of connection portions by minimizing an overlapping area between a lower first conduction line and an upper second conduction line at a contact region defined in the first conduction line upon connecting the second conduction line to the first conduction line. The minimized overlapping area can be obtained by forming the second conduction line in a self-aligned manner.

REFERENCES:
patent: 4997790 (1991-03-01), Woo et al.
patent: 5026666 (1991-06-01), Hills et al.
patent: 5158910 (1992-11-01), Cooper et al.

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