Endoscope using a chip carrier type solid state imaging device

Facsimile and static presentation processing – Static presentation processing – Attribute control

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128 6, H04N 718

Patent

active

047454709

ABSTRACT:
A solid state imaging device and a substrate to which this solid state imaging device is fitted is contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface of the substrate. The positions of the conductive parts, when that the conductive parts are overlapped with the solid state imaging device, are retreated to be within the electrode positions of the solid state imaging device so that the imaging device may be contained in a small space.

REFERENCES:
patent: 4491865 (1985-01-01), Danna et al.
patent: 4519391 (1985-05-01), Murakoshi
patent: 4539586 (1985-09-01), Danna et al.
patent: 4573450 (1986-03-01), Arakawa

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