Method for manufacturing a lay-in ceiling panel

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156263, 156291, B29C 6552, B32B 3104

Patent

active

051748495

ABSTRACT:
A lay-in ceiling panel structure, comprising a glass fiber ply, a gypsum board, and a highly perforated vinyl lamina. The ceiling panel structure having noise and sound transmission reduction coefficients in the range of 0.85 to 0.95 sabins and 0.35 to 0.39 dbs respectively. This structure also provides good fire resistance, space efficiency, and a lower surface that is washable and pleasing to the eye. In addition, the glass fiber ply is secured to the gypsum board by droplets of glue which are spaced 1 to 2 inches apart and which are applied 4 to 6 inches away from the outer periphery of the gypsum board. Applying the glue in this way allows the glass fiber ply and vinyl lamina to lay flat even if the board is warped by water leaks, humidity or age.

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