Process for the production of a circuit arrangement on a support

Details Process for the production of a circuit arrangement on a support Process for the production of a circuit arrangement on a support

1991-03-08

1992-12-29

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156267, 156269, 156248, B32B 3100

Patent

active

051748479

ABSTRACT:
The circuit arrangement has at least one electrically conductive cut conductor track on at least one surface of a support film, the support film being free of deformations and fluctuations in the thickness, both in the region of the conductor track covering it and outside this region. The edges of the conductor track have a projection in the form of a stamping burr. A negative circuit is applied to a stamping substrate or embossed in the latter by means of embossing dies or punching tools constituting a block; the conductor track representing the remaining positive circuit is transferred to the support film.

REFERENCES:
patent: 2776235 (1957-01-01), Peck
patent: 2969300 (1961-01-01), Franz
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 3585093 (1971-06-01), Britt
patent: 3678577 (1975-07-01), Weglin et al.
patent: 4717438 (1988-01-01), Benge et al.
patent: 4818312 (1989-04-01), Benge
patent: 4859263 (1989-08-01), Dziurla et al.
patent: 4914079 (1990-04-01), Takei et al.

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