Method for manufacturing a three-dimensional circuit substrate

Details Method for manufacturing a three-dimensional circuit substrate Method for manufacturing a three-dimensional circuit substrate

1991-02-05

1992-02-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29848, 156285, H01K 310

Patent

active

050901222

ABSTRACT:
This invention provides a method for manufacturing a three-dimensional circuit substrate. In the method, a conducting portion comprising a circuit pattern is formed on the surface of a film. The film is placed over a resin board in a mold in which the conducting portion of the film is opposed to the resin board. Subsequently, blow molding or vacuum forming is applied to the mold. The film and the resin board are thus closely overlapped, heat-bonded, and formed into the three-dimensional circuit substrate having a desired configuration. Through such minimum process steps, the three-dimensional circuit substrate with the complicated configuration can be manufactured easily with reduced cost.

REFERENCES:
patent: 4127436 (1978-11-01), Friel
patent: 4407685 (1983-10-01), Hankland
patent: 4463055 (1984-07-01), Hodges
patent: 4584767 (1986-04-01), Gregory
patent: 4647005 (1987-02-01), Seifert
patent: 4927733 (1990-05-01), Stout
patent: 4944087 (1990-07-01), Landi
patent: 4944908 (1990-07-01), Leveque et al.
patent: 4985116 (1991-01-01), Mettler et al.

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