Non-corrosive cleaning composition for removing plasma etching r

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

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510176, 510437, 134 2, 134 3, 134 13, 134 38, 134 40, 134 41, 134 42, C11D 726, C11D 732, C11D 760, B08B 308

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057804060

ABSTRACT:
A non-corrosive cleaning composition for removing plasma etching residues having a pH from 2 to 6 and comprising: (A) water; (B) at least one selected hydroxylammonium compound; and (C) at least one basic compound; and optionally (D) a chelating stabilizer; and optionally (E) a surfactant.

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