Method of making electrically conductive thin epoxy bond

Details Method of making electrically conductive thin epoxy bond Method of making electrically conductive thin epoxy bond

1984-06-04

1985-11-12

Schofer, Joseph L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156276, 1563073, C09J 302

Patent

active

045526079

ABSTRACT:
The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.

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patent: 4407883 (1983-10-01), Newton
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