Method and apparatus for chemical/mechanical polishing

Details Method and apparatus for chemical/mechanical polishing Method and apparatus for chemical/mechanical polishing

1996-02-27

1998-07-14

Eley, Timothy V.

Abrading

Abrading process

With tool treating or forming

451287, 451288, B24B 100

Patent

active

057795215

ABSTRACT:
A polishing method and apparatus applied for planarizing a substrate presenting surface step differences in a production process for a substrate of a semiconductor device. The substrate is ground by being brought into sliding contact with a polishing cloth applied taut on a rotary table as a polishing agent is supplied to the polishing cloth. The grinding for the substrate is carried out until partway under a first condition in which the polishing cloth is ground under a pre-set condition by being slidingly contacted with grinding abrasive grains of the rotary grinding head so that surface roughness of the polishing cloth is maintained at a substantially constant value equal to the surface roughness value prevailing prior to start of grinding. The residual portion of the polishing is carried out under a second condition in which the surface roughness of the polishing cloth is gradually lowered by terminating the grinding. Polishing with superior planarity may be achieved in a shorter time.

REFERENCES:
patent: 5032203 (1991-07-01), Doy et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5516327 (1996-05-01), Kawasaki
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.

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