Method for surface mounting a heatsink to a printed circuit boar

Details Method for surface mounting a heatsink to a printed circuit boar Method for surface mounting a heatsink to a printed circuit boar

1996-10-31

1998-07-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282481, 438122, H05K 334

Patent

active

057791341

ABSTRACT:
A low cost method for attaching a heat slug to a printed circuit board using surface-mount technology. In one embodiment a metal coating is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.

REFERENCES:
patent: 4046442 (1977-09-01), Hutchison
patent: 4321423 (1982-03-01), Johnson et al.
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4598308 (1986-07-01), James et al.
patent: 4890196 (1989-12-01), Hinshaw
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5172031 (1992-12-01), Schneider
patent: 5189261 (1993-02-01), Alexander et al.
patent: 5255431 (1993-10-01), Burdick
patent: 5293301 (1994-03-01), Tanaka et al.
patent: 5306670 (1994-04-01), Mowatt et al.
International Search Report PCT/US96/15751, Mar. 5, 1997.

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