Interface structures for electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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29829, 29832, 156155, 156327, 156345, 216 13, 216 17, 216 56, 216 65, 216 72, 361768, 361774, 361795, 438107, 438118, 438125, 438598, 438940, H01L 23498, H01L 2340

Patent

active

059006749

ABSTRACT:
An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

REFERENCES:
patent: 4641222 (1987-02-01), Derfiny et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5449427 (1995-09-01), Wojnarowski et al.
patent: 5454904 (1995-10-01), Ghezzo et al.
patent: 5527741 (1996-06-01), Cole et al.

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