Low-temperature fusing brazing material, and wiring board and se

Details Low-temperature fusing brazing material, and wiring board and se Low-temperature fusing brazing material, and wiring board and se

1996-08-26

1999-05-04

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257779, 257706, H01L 2348, H01L 2352, H01L 2940

Patent

active

059006730

ABSTRACT:
A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.

REFERENCES:
patent: 4872047 (1989-10-01), Fister et al.
patent: 5049972 (1991-09-01), Uda et al.
patent: 5550407 (1996-08-01), Ogashiwa

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