Component mounting apparatus and method, and component mounting

Details Component mounting apparatus and method, and component mounting Component mounting apparatus and method, and component mounting

1996-11-05

1998-07-14

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29714, 29740, 29742, 29743, 294 641, 414737, 414752, H05K 330, H05K 1304

Patent

active

057785252

ABSTRACT:
There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

REFERENCES:
patent: 4480780 (1984-11-01), Claeskens et al.
patent: 4573262 (1986-03-01), Dornes et al.
patent: 4624050 (1986-11-01), Hawkswell
patent: 4631812 (1986-12-01), Young
patent: 5191702 (1993-03-01), Goedecke et al.
patent: 5410801 (1995-05-01), Shiloh et al.

Affiliated with

Also associated with

Rating

Component mounting apparatus and method, and component mounting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component mounting apparatus and method, and component mounting , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component mounting apparatus and method, and component mounting will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1870943