Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1996-05-30

1998-02-24

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 59, 228105, H01L 21603

Patent

active

057204241

ABSTRACT:
In a wire bonding apparatus used in manufacturing, for instance, semiconductor devices, a cover is attached to a detection image intake section of the camera mirror tube of a camera which detects the bonding points of a semiconductor workpiece, and the cover covers an area where a variation in air density occurs between the detection image intake section of the camera mirror tube and the semiconductor workpiece.

REFERENCES:
patent: 5211325 (1993-05-01), Schweizer et al.
patent: 5501388 (1996-03-01), Takeuchi

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