Metal working – Method of mechanical manufacture – With testing or indicating
Patent
1986-09-12
1988-05-31
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
With testing or indicating
29709, 29712, 29721, 29743, 29760, B23Q 1722
Patent
active
047471980
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE ART
The present invention relates to a method of detecting a hold-position of an electronic component in which the electronic component is held by an electronic-component holding apparatus utilizing attraction by vacuum suction or grip by a pair of gripping jaws for the holding of the component, to an electronic-component holding apparatus having a hold-position detecting device, and to an electronic-component mounting apparatus for mounting an electronic component on a mount member such as a printed circuit board.
RELATED ART STATEMENT
The above-identified electronic-component holding apparatus is widely used, for example, in an apparatus for automatically mounting electronic components on a printed-circuit board.
The document of Japanese Patent Application published under Publication No. 58-213496 discloses to detect using an image device a hold-position of an electronic component in which the component is held by an electronic-component holding apparatus as indicated above, and to substantially adjust any incorrect hold-position, by means of rotating a holding head which keeps hold of the component and/or of re-positioning a printed-circuit board on which the component is to be mounted, based on the result from the detection.
However, since the image device of the apparatus disclosed is adapted to detect the electronic component by utilizing light reflected by the component, the image device is liable to be badly influenced by roughness and/or tone of color on the surface of the component. Thus, there has been experienced a problem that the image device is incapable of detecting the hold-position for some electronic components. Moreover, in the case where a single image device is responsible for various kinds of electronic components, it is very difficult for the image device to detect all the components, with precision.
The above-identified document of Japanese Patent Application No. 58-213496 further discloses an electronic-component mounting apparatus for automatically mounting an electronic component on a mount such as a printed-circuit board, in which the component is re-positioned by means of rotation thereof about an axis thereof with a holding head before the mounting. This mounting apparatus is shown in FIG. 11. The holding head in the form of a sucking head 230 is supported by a head support 234 such that the sucking head 230 is rotatable about a center line of a sucking portion of a sucking pipe 232 which is capable of holding an electronic component by means of sucking action therethrough. An image device (not shown) detects a rotational (angular) position of the electronic component 236 about a center line of the sucking portion. Based on the result from the detection, a head rotator 238 rotates the sucking head 230 by an angle required for adjustment of the rotational position (posture) of the component 236. Then, the component 236 is mounted on a mount such as a printed-circuit board. Thus, electronic components are mounted on the mount with higher precision, because each electronic component 236 is mounted after adjustment of the incorrect hold-position (posture) of the component 236 in which the component 236 is held by the sucking head 230.
However, the head rotator 238 of the above-indicated electronic-component mounting apparatus is disposed on the head support 234 which supports the sucking head 230 such that the sucking head 230 is rotatable, and therefore is moved together with the head support 234. This construction results in increased mass of a portion which moves together with the sucking head 230. Accordingly, it is very difficult to move the sucking head 70 at a high speed, and to increase the efficiency of the work for mounting the electronic components on the mount.
The sucking head 230 of the mounting apparatus disclosed has a held portion 240 which has a shape of an arc having a center on the center line of the sucking portion of the sucking pipe 232. The held portion 240 is supported by the head support 234 through guide rolls 242. The head rotator 238
REFERENCES:
patent: 4529315 (1985-07-01), Cohen et al.
patent: 4598456 (1986-07-01), McConnell
patent: 4615093 (1986-10-01), Tews et al.
patent: 4628464 (1986-12-01), McConnell
patent: 4654964 (1987-04-01), Schneider et al.
patent: 4675993 (1987-01-01), Harada
Asai Koichi
Muto Yasuo
Tsuda Mamoru
Fuji Machine Mfg. Co. Ltd.
Goldberg Howard N.
Gorski Joseph M.
LandOfFree
Method and apparatus for detecting hold-position of electronic c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for detecting hold-position of electronic c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for detecting hold-position of electronic c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1867119