Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-04-01
1983-03-22
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
148 15, 148187, 427 531, 357 91, 357 15, H01L 2126, H01L 21263
Patent
active
043770312
ABSTRACT:
Generally, a complicated process is required in manufacturing a semiconductor device containing a Schottky barrier diode and a polycrystalline silicon layer which prevents excessive reaction of the aluminum electrode and silicon material involved. Because of the inability of the aluminum electrode to provide a good Schottky barrier by its contact with the polycrystalline silicon layer, it is required to directly contact the electrode with a monocrystalline silicon semiconductor layer or substrate. According to the present invention, this process is simplified by monocrystallizing the polycrystalline silicon layer at least in the region in which a Schottky barrier diode is to be formed by annealing the silicon layer in said region by laser beam irradiation and applying an aluminum electrode thereto.
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Goto Hiroshi
Sugishima Kenji
Fujitsu Limited
Roy Upendra
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