Printhead with field oxide as thermal barrier in chip

Incremental printing of symbolic information – Ink jet – Ejector mechanism

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347 63, B41J 205

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active

057741484

ABSTRACT:
In an active ink jet printhead chip (13) a layer of boron-phosphorus doped silicate glass (BPSG) immediately underneath the heaters followed by a silicon dioxide layer. This insulates the substrate during the fire pulse of its heater, yet allows thermal energy to diffuse into the silicon during the time between firing pulses.

REFERENCES:
patent: 5055859 (1991-10-01), Wakabayashi et al.
patent: 5081473 (1992-01-01), Hawkins et al.
patent: 5122812 (1992-06-01), Hess et al.
patent: 5159353 (1992-10-01), Fasen et al.
patent: 5322811 (1994-06-01), Komuro et al.
patent: 5376231 (1994-12-01), Matsumoto et al.
patent: 5469200 (1995-11-01), Terai
patent: 5479197 (1995-12-01), Fujiwara et al.
patent: 5517224 (1996-05-01), Kaizu et al.
patent: 5534069 (1996-07-01), Kuwabara et al.
patent: 5635966 (1997-06-01), Keefe et al.
patent: 5639386 (1997-06-01), Burke et al.

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