Shaped material for use in sealing electronic parts

Details Shaped material for use in sealing electronic parts Shaped material for use in sealing electronic parts

1990-06-18

1992-06-30

Sluby, P. C.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428414, 428415, 428412, 428419, 4284735, 4284744, 428525, 427410, B32B 2738, B05D 136

Patent

active

051261880

ABSTRACT:
The present invention provides a film-coated shaped material for use in sealing an electronic part having high shape retentivity and prepared by blanking a film-coated epoxy resin sheet in a shape in conformity with the configuration of the electronic part, the epoxy resin sheet comprising a plastics film having a thickness of 10 to 1000.mu. and a layer of a curable epoxy resin composition in a substantially uncured state and formed on one surface of the film, the epoxy resin composition comprising per 100 parts by weight of an epoxy resin, 5 to 50 parts by weight of a thermoplastic resin having a number average molecular weight of at least 5000, 5 to 300 parts by weight of an inorganic filler and a curing agent, and a chip sealing material flow preventing frame comprising the above film-coated epoxy resin.
The present invention further provides a shaped material for use in sealing an electronic part, having high shape retentivity and comprising the film-coated epoxy resin sheet, the shaped material being thermally curable by two divided steps, i.e., a first step of gelling the shaped material at a temperature at which the material melts and adheres to an adherend without flowing out, and a second step of curing the epoxy resin composition at a higher temperature than in the first step without allowing the composition to flow out, and a chip sealing material flow preventing frame comprising the shaped material.

REFERENCES:
patent: 4761335 (1988-08-01), Aurichio et al.

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