Thin film bonding method employing a structure for removing wett

Details Thin film bonding method employing a structure for removing wett Thin film bonding method employing a structure for removing wett

1990-04-24

1992-06-30

Aftergut, Jeff R.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 87, 1563088, 156324, 156344, 427359, B32B 3110

Patent

active

051259990

ABSTRACT:
A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

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