Method and apparatus for uniform flow distribution in plasma rea

Details Method and apparatus for uniform flow distribution in plasma rea Method and apparatus for uniform flow distribution in plasma rea

1988-12-29

1992-01-28

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723, 204164, H01L 2100

Patent

active

050841262

ABSTRACT:
A plasma flow is uniformly distributed over the surface of a water (76) by an L-shaped tube (64) and a distribution ring (62). A dispersal gas, which may either comprise an inert gas or a gas that cooperates with the reactive species of the plasma, is sprayed from the tube (64) and the ring (62) into the flow of the plasma. The ring (62) comprises a hollow tube encircling the outlet of a plasma reactor. A gas is circulated through the ring (62) within the hollow interior (66) and is emitted therefrom by nozzles (70). The tube (64) comprises a quartz or anodized aluminum L-shaped tube which is positioned directly in the flow of the plasma. The gas is emitted from the tube (64) in a direction directly opposite and into the flow of the plasma.

REFERENCES:
patent: 4401054 (1981-04-01), Matsuo et al.
patent: 4615756 (1986-10-01), Tsujii et al.
patent: 4664747 (1987-05-01), Sekiguchi et al.
patent: 4689112 (1987-08-01), Bersin
patent: 4898118 (1990-02-01), Murakami et al.
IBM Technical Disclosure; "Method of Preparing Hydrogenated Amorphous Silicon"; vol. 22 No. 8A-1/1/80.

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