Apparatus and method for making laminated electrical or electron

Details Apparatus and method for making laminated electrical or electron Apparatus and method for making laminated electrical or electron

1995-09-28

1998-06-30

Dixon, Merrick

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

156510, 156516, 156519, 156522, 156530, 156538, 156543, 156509, 83215, 83218, 83277, B32B 3100

Patent

active

057728380

ABSTRACT:
Apparatus and a method for production of laminated electronic or electrical devices are described which enables one thin patterned or unpatterned substrate to be easily and accurately incorporated into a previous stack of substrates by registration of a coated tape from which the substrate is excised. In the present invention the tape is indexed to a fixed position and then a platen with the previously stacked substrates is brought into registration with the stationary tape, following which the substrate is excised from the coated tape and added to the stack of substrates. Since the tape always is positioned in the equipment as indexed at the same location with each indexing step, and since once indexed the tape does not move, the platen can be brought into accurate alignment and registration with the tape. This invention lends itself to the manufacture of virtually any type of capacitor, semiconductor chip, integrated circuit, printed circuit board or similar electrical or electronic device which is formed of successive, aligned and registered layers, all bonded into a unitary device. The scope is limited only by the different circuits which can be printed or otherwise incorporated onto the ceramic substrate.

REFERENCES:
patent: 4385959 (1983-05-01), Goguer
patent: 4861657 (1989-08-01), Nishino et al.
patent: 4990080 (1991-02-01), Kakimoto
patent: 5254413 (1993-10-01), Marticocchi

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